Analysis of technical hardiness of TWS earphone pogopin
Lub pogo tus pin hauv TWS Bluetooth lub mloog pob ntseg yog siv los txuas Bluetooth, kov lub motherboard, txuas LDS kav hlau txais xov, inductive kov, thiab lwm yam.
1. PogoPin ib puag ncig kuaj
TWS earphones muaj cov cai tshwj xeeb rau electroplating ntawm PogoPin pogo pins nyob rau hauv cov nqe lus ntawm tes hws, electrolysis, thiab electrified corrosion.
• Cov xwm txheej kev sim tshwj xeeb ntawm txhua lub mloog pob ntseg TWS yuav txawv me ntsis, thiab txawm tias tib yam kev sim, cov kev sim sib txawv, lossis cov electrolytes sib txawv tuaj yeem tsim cov txiaj ntsig sib txawv.
• Hom hws: 1. Pas Dej Test ISO3160-2 (7 Cheebtsam); 2. Pickering Sweat (33 yam)
2. PogoPin daim iav tig tshuab
"Daim iav tig" txais yuav high-precision CNC lathes, thiab siv finely tshawb fawb pob zeb diamond tig cov cuab yeej los tig cov khoom ntawm kev kub ceev, kom cov nto ntawm cov khoom yuav ci li ib daim iav, thiab cov cuab yeej ntse heev yog siv los ua micro- txiav ntawm cov khoom rau ntau zaus kom lub workpiece ncav cuag siab Dimensional raug thiab smoothness kuj hu ua "superfinishing".
